![]() |
| CAD, CAM, CAE, design, technical drawing, drafting, delineation, visualization, manufacturing | ISSN 1442-2255 |
|
|
Zuken and Industry Partners Pioneer Design and Supply Chain Methodology for System-in-Package Technology
Munich, Germany and Westford, MA USA, March 14 th, 2007 - Zuken, the engineering consulting company, has joined a UK government-driven initiative; the ADEPT-SiP project, that has been set up with the objective of developing a rigorous methodology to assist organizations across the globe in the design and manufacture of system-in-package technology. The product of this right-first-time design and supply chain methodology will be a design kit for embedded components within printed circuit boards, including functionality for simulation and modelling. Zuken' s initial role is to establish SiP (system-in-package) design to manufacturing requirements and define the direction for new design solution development. After analyzing the entire design process, Zuken will provide recommendations for development of the software elements required from each industry partner in order to generate the complete design kit. The availability of this package will then enable SiP to be widely adopted within the electronics industry. "The mass use of cellular phones, laptops, cameras, PDAs and general RF and wireless devices has really driven an increase in demand for SiP technology. We recognize a real requirement for developing design tools and methodologies that will allow this rapid market growth to continue. By working with the UK government and industry partners, we hope to focus on addressing these R&D needs," stated Tony Cadwell, Zuken's Northern Europe Sales Manager involved in this project. About Zuken Zuken is trusted globally by leading companies to optimize their electrical and electronic engineering design and related manufacturing processes. Our unique combination of proven experience, technological expertise and agility, creates electronic design automation (EDA) solutions as well as computer aided engineering (CAE) solutions that are innovative, dynamic and powerful. With over 30 years experience, Zuken has grown to become the world's leading provider of EDA software and electronic product lifecycle management (e-PLM). Our solutions optimize the efficiency of electronics and electrical R&D, engineering, manufacturing, new product introduction (NPI), component purchasing and component engineering in the PCB/MCM/HIC market. Listed on Level 1 of the Tokyo Stock Exchange, Zuken improves product quality and profitability for electrical and electronics manufacturers globally, from automotive to aerospace, communications to consumer electronics, power to heavy machinery and medical to military markets. With headquarters in Japan, we have development and support centers in 10 countries - including the US, Germany, UK, France, Italy, China and Taiwan - and are a trusted partner of more than 4,800 organizations, with over 45,000 individual licenses, worldwide. About the ADEPT SiP Project: The 30-month ADEPT-SiP project started in May 2006 and will develop and demonstrate a rigorous, right-first-time design and supply chain management methodology for novel System-in-Package Electronics Product Functions. It will address schematic capture, partitioning and active device, substrate and package design to meet specific performance, cost, size and weight targets. Other key design stages will include thermal and EMC design, and design-for-manufacture, for test, reliability and for environmental impact. Novel, high density embedded passive substrate technologies will be designed and simulated, process characterisation undertaken and component models developed for the full range of passive components and interconnection and assembly structures. The core design, simulation and modelling activities will then be proven in SiP technology demonstrators. The ADEPT-SiP project partners include Filtronic Broadband and Zarlink Semiconductors' Advanced Packaging Division based in Caldicot as SiP product end-users, Leeds University as modelling provider, Zuken, QuantumCAD and Flomerics as design providers, and Wurth Elektronik and TWI as technology providers. |